The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
Ready for overclocking, benchmarking and silent cooling.
The first-ever CPU heatsink to use vertical vapor chamber technology.
100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
Special fin design – heatsink receives concentrated cold airflow.
Improved air pressure design and fan mounting system.